aos semiconductor product reliability report AON7520 , rev a plastic encapsulated device alpha & omega semiconductor, inc www.aosmd.com
this aos product reliability report summarizes the qualification result for AON7520 . accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. review of final electrical test result confirms that AON7520 passes aos quality and reliability requirements. table of contents: i. product description ii. package and die information iii. environmental stress test summary and result iv. reliability evaluation i. product description: ? latest trench power alphamos ( mos lv) technology ? very low rds(on) at 2.5v vgs ? low gate charge ? esd protection application ? load switch, battery switch in portable devices - rohs compliant - halogen - free detailed information refers to datasheet. ii. die / package information: AON7520 process standard sub - micron l ow voltage n channel package type dfn 3.3x3.3 ep lead frame bare c u die attach solder paste bonding cu clip mold material epoxy resin with silica filler msl (moisture sensitive level) level 1 based on j - std - 020
iii. result of reliability stress for AON7520 test item test condition time point lot attribution total sample size number of failures standard msl precondition 168hr 85 c /85 %rh +3 cycle reflow@260c - 12 lots 2618 pcs 0 jesd22 - a113 htgb temp = 150 ? c , vgs=100% of vgsmax 168 hrs 500 hrs 1000 hrs 3 lots 4 lots 3 lots 770 pcs 77pcs / lot 0 jesd22 - a 108 htrb temp = 150 ? c , vds=80% of vdsmax 168 hrs 500 hrs 1000 hrs 3 lot s 4 lots 3 lots 770 pcs 77pcs / lot 0 jesd22 - a108 hast 130 ? c , 85% rh , 33.3 psi, v d s = 8 0 % of v d s max 96 hrs 11 lots (note a*) 847 pcs 77 pcs / lot 0 jesd22 - a110 pressure pot 121 ? c , 29.7psi , rh=100% 96 hrs 11 lots (note a*) 847 pcs 77 pcs / lot 0 jesd22 - a102 temperature cycle - 65 ? c to 150 ? c , air to air 250 / 500 cycles 12 lots (note a*) 924 pcs 77 pcs / lot 0 jesd22 - a104 note a: the reliability data presents total of available generic data up to the published date. iv. reliability evaluation fit rate (per billion): 4.16 mt t f = 27446 years the presentation of fit rate for the individual product reliability is restricted by the actual burn - in sample size of the selected product ( AON7520 ). failure rate determination is based on jedec standard jesd 85. fit means one failure per billion hours. failure rate = chi 2 x 10 9 / [ 2 (n) (h) (af) ] = 1.83 x 10 9 / [ 2 x ( 6 x77x 168 + 8x77x500 +6 x77x 1000) x 2 59 ] = 4.16 mt t f = 10 9 / fit = 2.40 x 10 8 hrs = 27446 years chi2 = chi squared distribution, determined by the number of failures and confidence interval n = total number of units from htrb and htgb tests h = duration of htrb/htgb testing af = acceleration factor from test to use conditions (ea = 0.7ev and tuse = 55 c ) acceleration factor [af ] = exp [ea / k ( 1/tj u C 1/tj s )] acceleration factor ratio list: 55 deg c 70 deg c 85 deg c 100 deg c 115 deg c 130 deg c 150 deg c af 2 59 8 8 32 13 5.64 2.59 1 tj s = stressed junction temperature in degree (kelvin), k = c+273.16 tj u = the use junction temperature in degree (kelvin), k = c+273.16 k = boltz m an n s constant, 8.617164 x 10 - 5 e v / k
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